Summary
The ongoing global trend of miniaturization is driven by the demand for a huge range of high-end devices such as smartphones, automotive connectivity and IoT/AI applications. This is highly dependent on the fabrication of embedded Integrated Circuits on semiconductor wafers & the advanced semiconductor packaging processes that protect ICs while providing connectivity to printed circuit boards & adjacent ICs. The fabrication of redistribution layers (RDL), is particularly challenging and expensive, representing a major challenge in the industry. Current RDL microfabrication technology constitutes multi-process chain (19 steps) and is incredibly capital intensive. Existing technology impacts the environment through vast consumption of energy and water. It provides limited flexibility at the wafer-level, restricting the use of optimised materials to microfabricate and limiting manufacturers ability to produce different packaging designs between production cycle, incurring high-fixed costs or expensive downtimes.
NanoDrip is the first printing technology which is applicable to advanced packaging, providing ultra-high-resolution microfabrication suitable for industrial manufacturing in merely 2 step-process. It enables digitality, the capability to produced different designs between production cycles with unprecedented flexibility. It introduces a disruptive paradigm shift in the fabrication of advanced electronics at a crucial time for the European industry, allowing European SMEs & large semiconductor manufacturers to gain competitive advantage as demand grows for next-generation of devices. During the phase 1 project, Scrona will establish a go-to-market strategy and a supply chain and will draft further development plan. During the innovation project, Scrona will optimise their proprietary printheads and printing process, optimize in-house printhead manufacturing process, and carry out large-scale demonstration of microfabrication with relevant stakeholders.
NanoDrip is the first printing technology which is applicable to advanced packaging, providing ultra-high-resolution microfabrication suitable for industrial manufacturing in merely 2 step-process. It enables digitality, the capability to produced different designs between production cycles with unprecedented flexibility. It introduces a disruptive paradigm shift in the fabrication of advanced electronics at a crucial time for the European industry, allowing European SMEs & large semiconductor manufacturers to gain competitive advantage as demand grows for next-generation of devices. During the phase 1 project, Scrona will establish a go-to-market strategy and a supply chain and will draft further development plan. During the innovation project, Scrona will optimise their proprietary printheads and printing process, optimize in-house printhead manufacturing process, and carry out large-scale demonstration of microfabrication with relevant stakeholders.
Unfold all
/
Fold all
More information & hyperlinks
| Web resources: | https://cordis.europa.eu/project/id/885550 |
| Start date: | 01-11-2019 |
| End date: | 29-02-2020 |
| Total budget - Public funding: | 71 429,00 Euro - 50 000,00 Euro |
Cordis data
Original description
The ongoing global trend of miniaturization is driven by the demand for a huge range of high-end devices such as smartphones, automotive connectivity and IoT/AI applications. This is highly dependent on the fabrication of embedded Integrated Circuits on semiconductor wafers & the advanced semiconductor packaging processes that protect ICs while providing connectivity to printed circuit boards & adjacent ICs. The fabrication of redistribution layers (RDL), is particularly challenging and expensive, representing a major challenge in the industry. Current RDL microfabrication technology constitutes multi-process chain (19 steps) and is incredibly capital intensive. Existing technology impacts the environment through vast consumption of energy and water. It provides limited flexibility at the wafer-level, restricting the use of optimised materials to microfabricate and limiting manufacturers ability to produce different packaging designs between production cycle, incurring high-fixed costs or expensive downtimes.NanoDrip is the first printing technology which is applicable to advanced packaging, providing ultra-high-resolution microfabrication suitable for industrial manufacturing in merely 2 step-process. It enables digitality, the capability to produced different designs between production cycles with unprecedented flexibility. It introduces a disruptive paradigm shift in the fabrication of advanced electronics at a crucial time for the European industry, allowing European SMEs & large semiconductor manufacturers to gain competitive advantage as demand grows for next-generation of devices. During the phase 1 project, Scrona will establish a go-to-market strategy and a supply chain and will draft further development plan. During the innovation project, Scrona will optimise their proprietary printheads and printing process, optimize in-house printhead manufacturing process, and carry out large-scale demonstration of microfabrication with relevant stakeholders.
Status
CLOSEDCall topic
EIC-SMEInst-2018-2020Update Date
27-10-2022
Geographical location(s)
Structured mapping
Unfold all
/
Fold all
