Summary
USound develops cutting-edge piezoelectric MEMS technology for providing Micro Electronic-Acoustic devices expanding
the functionalities of earphones and headphones, with exceptional audio performance, lean manufacturing flow,
miniaturization, simple integration and low power consumption thereby overcoming the limitations of all the existing
technologies on the market. USound gains competitive advantage through the collaboration with best in class European
scientific and industrial partners, applying the high potential “fabless semiconductor” business model. The underlying
technology is based on three main technology blocks: Piezoelectric MEMS, Embedded Component Packaging technology
and Standard complementary metal–oxide–semiconductor (CMOS) process and has already reached TRL 6. USound’s first
product will be a sub-miniature speaker for in-ear or near-the-ear headphones.
Manufacturers face an increasing demand for improved sound quality, for devices with ever more functions and lower power
consumption, and a fierce competition within the industry, resulting in decreasing gross margins and selling prices. USound
B2B customers will gain competitive advantage through 20% overall cost reduction, low power applications, higher
integration, design flexibility and improved sound quality which allow offering devices with new and improved functions. The
feasibility study will support final prototyping, validation & demonstration to reach TRL 9 and provides the economic
arguments (risk management, IP strategy, Business plan) to ensure further private investments, public funding (e.g. SME
phase 2) and boosting the market uptake. With USound technology Europe will have the opportunity to take over a leading
role in the field of MEMS technology for the global Micro Electronic-Acoustics market, building up unique knowhow protected
by patents and fostering Europe as a high class R&D location with new jobs and high competitiveness towards competition
from the US and Asian markets
the functionalities of earphones and headphones, with exceptional audio performance, lean manufacturing flow,
miniaturization, simple integration and low power consumption thereby overcoming the limitations of all the existing
technologies on the market. USound gains competitive advantage through the collaboration with best in class European
scientific and industrial partners, applying the high potential “fabless semiconductor” business model. The underlying
technology is based on three main technology blocks: Piezoelectric MEMS, Embedded Component Packaging technology
and Standard complementary metal–oxide–semiconductor (CMOS) process and has already reached TRL 6. USound’s first
product will be a sub-miniature speaker for in-ear or near-the-ear headphones.
Manufacturers face an increasing demand for improved sound quality, for devices with ever more functions and lower power
consumption, and a fierce competition within the industry, resulting in decreasing gross margins and selling prices. USound
B2B customers will gain competitive advantage through 20% overall cost reduction, low power applications, higher
integration, design flexibility and improved sound quality which allow offering devices with new and improved functions. The
feasibility study will support final prototyping, validation & demonstration to reach TRL 9 and provides the economic
arguments (risk management, IP strategy, Business plan) to ensure further private investments, public funding (e.g. SME
phase 2) and boosting the market uptake. With USound technology Europe will have the opportunity to take over a leading
role in the field of MEMS technology for the global Micro Electronic-Acoustics market, building up unique knowhow protected
by patents and fostering Europe as a high class R&D location with new jobs and high competitiveness towards competition
from the US and Asian markets
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More information & hyperlinks
| Web resources: | https://cordis.europa.eu/project/id/735980 |
| Start date: | 01-08-2016 |
| End date: | 31-01-2017 |
| Total budget - Public funding: | 71 429,00 Euro - 50 000,00 Euro |
Cordis data
Original description
USound develops cutting-edge piezoelectric MEMS technology for providing Micro Electronic-Acoustic devices expandingthe functionalities of earphones and headphones, with exceptional audio performance, lean manufacturing flow,
miniaturization, simple integration and low power consumption thereby overcoming the limitations of all the existing
technologies on the market. USound gains competitive advantage through the collaboration with best in class European
scientific and industrial partners, applying the high potential “fabless semiconductor” business model. The underlying
technology is based on three main technology blocks: Piezoelectric MEMS, Embedded Component Packaging technology
and Standard complementary metal–oxide–semiconductor (CMOS) process and has already reached TRL 6. USound’s first
product will be a sub-miniature speaker for in-ear or near-the-ear headphones.
Manufacturers face an increasing demand for improved sound quality, for devices with ever more functions and lower power
consumption, and a fierce competition within the industry, resulting in decreasing gross margins and selling prices. USound
B2B customers will gain competitive advantage through 20% overall cost reduction, low power applications, higher
integration, design flexibility and improved sound quality which allow offering devices with new and improved functions. The
feasibility study will support final prototyping, validation & demonstration to reach TRL 9 and provides the economic
arguments (risk management, IP strategy, Business plan) to ensure further private investments, public funding (e.g. SME
phase 2) and boosting the market uptake. With USound technology Europe will have the opportunity to take over a leading
role in the field of MEMS technology for the global Micro Electronic-Acoustics market, building up unique knowhow protected
by patents and fostering Europe as a high class R&D location with new jobs and high competitiveness towards competition
from the US and Asian markets
Status
CLOSEDCall topic
SMEInst-01-2016-2017Update Date
27-10-2022
Geographical location(s)
Structured mapping
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H2020-EU.2.1.1. INDUSTRIAL LEADERSHIP - Leadership in enabling and industrial technologies - Information and Communication Technologies (ICT)
