Summary
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Authors: Patrick Reinecke, Marie-Theres Putze, Leopold Georgi, Ruben Kahle, David Kaiser, Daniel Hüger, Pavel Livshits, Jens Weidenmüller, Thomas Weimann, Andrey Turchanin, Tanja Braun, Karl-Friedrich Becker, Martin Schneider-Ramelow, Klaus-Dieter Lang
Journal title: International Symposium on Microelectronics
Journal number: 2018/1
Journal publisher: International Microelectronics Assembly and Packaging Society
Published year: 2018
Published pages: 000672-000679
DOI identifier: 10.4071/2380-4505-2018.1.000672
ISSN: 2380-4505