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Authors: Maira Possas Abreu, Farbod Ghassemi, Lionel Rousseau, Gaelle Lissorgues, Massiel Habchi, Emmanuel Scorsone
Journal title: 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
Journal publisher: IEEE
Published year: 2016
Published pages: 1-5
DOI identifier: 10.1109/dtip.2016.7514883
ISBN: 978-1-5090-1457-6