Direct flip-chip bonding of bare dies to polypropylene-coated paper substrates without adhesives or solders

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Authors: Augusto Daniel Rodrigues, Thomas Weissbach, Muhammad Hassan Malik, Wolfgang Schmidt, Rainer Gumbiowski, Arved C Hübler, Alfred Binder, Ali Roshanghias

Journal title: Journal of Materials Science: Materials in Electronics

Journal number: 1573482X

Journal publisher: Springer Nature

Published year: 2022

Published pages: 19252–19262

DOI identifier: 10.1007/s10854-022-08763-z

ISSN: 1573-482X