Plan for access to technology

During the second phase a business plan will be drawn up to explore the different options by which the technology can be made widely available through foundry-like processes. This report will address the supply of transferrable components, the foundries to perform the transfer print and the foundries to perform the interconnections and device singulation. The wafer size (75mm-200mm) and compatibility (eg Au, topography issues) of the needed processes will be addressed.