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Authors: O. Leppäaho, F. Lafon, P. Fernández-López, M. Stojanovic, T. Claeys, R. Perdriau, M. Ramdani
Journal title: IEEE Transactions on Electromagnetic Compatibility
Journal number: Volume: 65, Issue: 2, April 2023
Journal publisher: Institute of Electrical and Electronics Engineers
Published year: 2023
Published pages: 395-405
DOI identifier: 10.1109/temc.2023.3244061
ISSN: 0018-9375