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Authors: Q. M. Khan, L. Devaraj, M. Koohestani, A. R. Ruddle, M. Ramdani, R. Perdriau
Journal title: IEEE Letters on Electromagnetic Compatibility Practice and Applications
Journal publisher: IEEE
Published year: 2022
DOI identifier: 10.1109/lemcpa.2022.3175433
ISSN: 2637-6423
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