Analysis and Estimation of Electromagnetic Energy Coupled into IC packages

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Authors: H. Tang, A. H. Venkateshaiah, J. F. Dawson, A. C. Marvin, M. P. Robinson and J. Ge

Journal title: IEEE Int. Joint EMC/SI/PI and EMC Europe Symp

Journal publisher: IEEE

Published year: 2021

DOI identifier: 10.1109/emc/si/pi/emceurope52599.2021.9559238