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Authors: N. Omollo, R. Vogt-Ardatjew, J. K. van der Ven, F. Leferink
Journal title: 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)
Journal publisher: IEEE
Published year: 2022
DOI identifier: 10.1109/emcsi39492.2022.9889312