System Integration and Packaging of a Terahertz Photodetector at $W$ -Band

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Authors: Yunfeng Dong, Tom Keinicke Johansen, Anuar de Jesus Fernandez Olvera, Alvaro Morales, Mario Mendez Aller, Sascha Preu, Vitaliy Zhurbenko, Peter Jesper Hanberg, Chigo Okonkwo, Idelfonso Tafur Monroy

Journal title: IEEE Transactions on Components, Packaging and Manufacturing Technology

Journal number: 9/8

Journal publisher: Institute of Electrical and Electronics Engineers Inc.

Published year: 2019

Published pages: 1486-1494

DOI identifier: 10.1109/tcpmt.2019.2928053

ISSN: 2156-3950