Integration of epitaxial monolayer MX₂ channels on 300mm wafers via Collective-Die-To-Wafer (CoD2W) transfer

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Authors: S. Ghosh, Q. Smets, S. Banerjee, T. Schram, K. Kennes, R. Verheyen, P. Kumar, M.-E. Boulon, B. Groven, H. M. Silva, S. Kundu, D. Cott, D. Lin, P. Favia, T. Nuytten, A. Phommahaxay, I. Asselberghs, C. De La Rosa, G. S. Kar, S. Brems

Journal title: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)

Journal publisher: IEEE

Published year: 2023

Published pages: 1-2

DOI identifier: 10.23919/vlsitechnologyandcir57934.2023.10185215