EOT Scaling Via 300mm MX2 Dry Transfer - Steps Toward a Manufacturable Process Development and Device Integration

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Authors: S. Ghosh, A. Kruv, Q. Smets, T. Schram, D. J. Leech, T. Ding, V. Turkani, B. Groven, A. Dangel, G. Probst, T. Uhrmann, M. Wimplinger, I. Asselberghs, C. J. Lockhart de la Rosa, S. Brems, G. S. Kar

Journal title: 2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)

Journal publisher: IEEE

Published year: 2024

Published pages: 1-2

DOI identifier: 10.1109/vlsitechnologyandcir46783.2024.10631364