Industrial photonics packaging for high volume applications

Summary

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Authors: Milan M. Milosevic, Zerihun G. Tegegne, Chunting Zhong, David van Duinen, Xin Yin, Johan Bauwelinck, Maria Massaouti, Efstathios Andrianopoulos, Panos Groumas, Michael Theurer, Durvasa Y. Gupta, Martin Kresse, Madeleine Weigel, David de Felipe, Norbert Keil, Joost van Kerkhof

Journal title: Proc. SPIE 12892, Optical Interconnects XXIV; 128920M (2024)

Journal publisher: SPIE

Published year: 2024

DOI identifier: 10.1117/12.3000934