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Authors: Arash Mohammadi, George Boldeiu, Dan Vasilache, Afshin Ziaei, Bernhard Wunderle
Journal title: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Journal publisher: IEEE
Published year: 2024
DOI identifier: 10.1109/EuroSimE60745.2024.10491501