Miniaturized Micrometer-Level Copper Wiring and Electrodes Based on Reverse-Offset Printing for Flexible Circuits

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Authors: Kim Eiroma, Asko Sneck, Olli Halonen, Tuomas Happonen, Henrik Sandberg, Jaakko Leppäniemi

Journal title: ACS Applied Electronic Materials

Journal publisher: American Chemical Society (ACS)

Published year: 2025

DOI identifier: 10.1021/ACSAELM.5C00230

ISSN: 2637-6113