(Invited) Wafer Bonding for MEMS Integration and Packaging

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Authors: Frank Niklaus, Gaehun Jo, Pierre Edinger, Kristinn B. Gylfason, Simon J. Bleiker

Journal title: ECS Meeting Abstracts

Journal number: MA2023-02

Journal publisher: The Electrochemical Society

Published year: 2024

DOI identifier: 10.1149/MA2023-02331615MTGABS

ISSN: 2151-2043