Summary
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Authors: Hong Deng, Jing Zhang, Emadreza Soltanian, Xiangfeng Chen, Chao Pang, Nicolas Vaissiere, Delphine Neel, Joan Ramirez, Jean Decobert, Nishant Singh, Guy Torfs, Günther Roelkens, Wim Bogaerts
Journal title: Optical Interconnects and Packaging 2025
Journal publisher: SPIE
Published year: 2025
DOI identifier: 10.1117/12.3044760