Design and Multiphysics Simulation of a PCB-Embedded-Package Enclosing a Gallium Nitride System on Chip Grown on a Novel Substrate

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Authors: Pradhan, A., Moldaschl, T., Hasan, M. N., Schicker, J., Binder, A., & De Doncker, R. W.

Journal title: PCIM Europe 2023; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management

Journal number: 09-11 May 2023

Journal publisher: VDE

Published year: 2023

DOI identifier: 10.30420/566091287

ISBN: 978-3-8007-6091-6