High-Speed TSV Integration in an Active Silicon Photonics Interposer Platform

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Authors: L. Bogaerts, Z. El-Mekki, S. Van Huylenbroeck, P. Nolmans, N. Pantano, X. Sun, M. Rakowski, D. Velenis, P. Verheyen, S. Balakrishnan, P. De Heyn, B. Snyder, Y. Ban, S. Srinivasan, S. Lardenois, J. De Coster, M. Detalle, P. Absil, A. Miller, M. Pantouvaki, J. Van Campenhout

Journal title: 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)

Journal publisher: IEEE

Published year: 2018

Published pages: 1-3

DOI identifier: 10.1109/s3s.2018.8640164

ISBN: 978-1-5386-7627-1